STRUCTURE AND ELECTRICAL PROPERTIES OF Sn8Zn SOLDER ALLOY WITH Ag AND Ga ADDITIONS
Keywords:lead-free solders, intermetallic phase, resistivity measurements
AbstractSolder joints based on eutectic SnZn alloy were studied. The influence of Ga and Ag was analysed and compared to the basic Sn8Zn alloy as well as to the reference solder alloys Sn60Pb40 and Sn3Cu. The formation of intermetallic layer in zinc-containing alloys
made mainly out of Cu5Zn8 type was noted, while in the standard solder alloys it was Cu3Sn. The resistivity measurements showed the lowest value for Sn8Zn1Ag and the worst in the case of Sn8Zn1Ga, due to the quite different incorporation of Ag and Ga
atoms in the solder: Ag atoms are found in precipitates while Ga atoms are dissolved in the matrix.
Download data is not yet available.
Kang S.K., Choi W.K.: Journal of Electronic Materials, Vol. 31 (2002) pp. 1292–1303
Islam M.N., Chan Y.C., Rizvi M.J., Jillek W., Journal of Alloys and Compounds, Vol. 400 (2005) pp. 136–144
Shin C.K., Baik Y.-J., Huh J.Y., Journal of Electronic Materials, Vol. 30 (2001) pp. 1323–1331
Boczkal G., Marecki P., Perek-Nowak M., Archives of Metallurgy and Materials, Vol. 57 (2012) pp. 33–37
Sigelko J., Choi S., Subramanian K.N., Lucas J.P., Bieler T.R., Journal of Electronic Materials, Vol. 28 (1999) pp. 1184–1188
Amagai M., Microelectronics Reliability, Vol. 48 (2008) pp. 1–16
Massalski T. B., Editor-in-Chief; H. Okamoto, P. R. Subramanian, L. Kacprzak, Editors. ASM International, Materials Park, Ohio, USA, (1990)
How to Cite
Boczkal, G., & Perek-Nowak, M. (2014). STRUCTURE AND ELECTRICAL PROPERTIES OF Sn8Zn SOLDER ALLOY WITH Ag AND Ga ADDITIONS. Metallurgy and Foundry Engineering, 39(1), 36. https://doi.org/10.7494/mafe.2013.39.1.36