• Michał Stępień AGH University of Science and Technology, Faculty of Non-Ferrous Metals Kraków, Poland
  • Piotr Palimąka AGH University of Science and Technology, Faculty of Non-Ferrous Metals Kraków, Poland
  • Andżelika Bukowska AGH University of Science and Technology, Faculty of Non-Ferrous Metals Kraków, Poland



indium, ITO, LCD panels, recycling


Due to the minute availability of indium and its crucial importance to the world economy, it is necessary to find alternative sources of this metal. As a large proportion of indium production is consumed for the purpose of LCD screen manufacturing, it seems reasonable to investigate their recycling leading to the recovery of this metal. The present work investigates the impact of time,
temperature, and the concentration of sulfuric acid on the effectiveness of indium extraction from milled LCD panel glass scrap originating from portable computers manufactured between 2005 and 2012. The conclusion of our research defines the optimal conditions for extraction.


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Rocchetti L., Amato A., Fonti V., Ubaldini S., De Michelis I., Kopacek B., Vegliò F., Beolchini F.: Cross-current leaching of indium from end-of-life LCD panels. Waste Management, 42 (2015), 180–187

Hasegawa H., Rahman M.M.I., Egawa Y., Sawai H., Begum Z.A., Maki T., Mizutani S.: Recovery of indium from end-of-life liquid-crystal display panels using aminopolycarboxylate chelants with the aid of mechanochemical treatment. Microchemical Journal, 106 (2013), 289–294

Leung W.S., Chan Y.C., Lui S.M.: A study of degradation of indium tin oxide thin films on glass for display applications. Microelectronic Engineering, 101 (2013), 1–7

Farhan M.S., Zalnezhad E., Bushroa A.R., Sarhan A.A.D.: Electrical and optical properties of indium-tin oxide (ITO) films by ion-assisted deposition (IAD) at room temperature. International Journal of Precision Engineering and Manufacturing, 14, 8 (2013), 1465–1469

Chou W.L., Huang Y.H.: Electrochemical removal of indium ions from aqueous solution using iron electrodes. Journal of Hazardous Materials, 172, 1 (2009), 46–53

Lee C.-H., Jeong M.-K., Kilicaslan M.F., Lee J.-H., Hong H.-S., Hong S.-J.: Recover of indium from used LCD panel by a time efficient and environmentally sound method assisted HEBM. Waste Management, 33, 3

(2013), 730–734

Alfantazi A.M., Moskalyk R.R.: Processing of indium: A review. Materials Engineering, 16 (2003), 687–693

Virolainen S., Ibana D., Paatero E.: Recovery of indium from indium tin oxide by solvent extraction. Hydrometallurgy, 107, 1–2 (2011), 56–61

Ferella F., Belardi G., Marsilii A., De Michelis I., Vegliò F.: Separation and recovery of glass, plastic and indium from spent LCD panels. Waste Management, 60 (2017), 569–581

Dodson J.R., Hunt A.J., Parker H.L., Yang Y., Clark J.H.: Elemental sustainability: Towards the total recovery of scarce metals. Chemical Engineering and Processing: Process Intensification, 51 (2012), 69–78

Yang J., Retegan T., Ekberg C.: Indium recovery from discarded LCD panel glass by solvent extraction. Hydrometallurgy, 137 (2013), 68–77

Swain B., Mishra C., Hong H.S., Cho S.-S.: Beneficiation and recovery of indium from liquid-crystal-display glass by hydrometallurgy. Waste Management, 57 (2016), 207–214

Fontana D., Forte F., De Carolis R., Grosso M.: Materials recovery from waste liquid crystal displays: A focus on indium. Waste Management, 45 (2015), 325–333

Ruan J., Guo Y., Qiao Q.: Recovery of Indium from Scrap TFT-LCDs by Solvent Extraction. Procedia Environmental Sciences, 16 (2012), 545–551

Zhang K., Wu Z., Wang W., Li B., Yhang Z., You T.: Recycling indium from waste LCDs: A review. Resources, Conservation and Recycling, 104 (2015), 276–290

Krištofová P., Rudnik E., Miškufová A.: Hydrometallurgical Methods of Indium Recovery from Obsolete LCD and LED Panels. Metallurgy and Foundry Engineering, 42, 3 (2016), 157–170




How to Cite

Stępień, M., Palimąka, P., & Bukowska, A. (2018). IMPACT OF SELECTED PARAMETERS ON EXTRACTION OF INDIUM FROM LCD SCREENS. Metallurgy and Foundry Engineering, 43(4), 305.