Ecological Electroplating Baths and Their Application in the Tin-coating of Copper Wires Intended for Photovoltaic Cables
DOI:
https://doi.org/10.7494/jcme.2023.7.3.31Abstract
Copper wires are covered with various coatings for many different applications. The most popular are tin based coatings and both their thickness and quality have been standardized by means of appropriate standard specifications. Copper wires intended for photovoltaic cables are subjected to especially high requirements due to their exceptionally long operating time and extremely unfavourable working conditions. Tin coatings are applied using the electroplating method and generally a fluoroborate bath is used during the process, however, it has been proved to be a health hazard in general and harmful to the environment as a whole. The paper presents the research results of a new ecological methane-sulfonate bath which does not form hazardous waste in the process. The examples of tin coatings of various thickness and the way of obtaining them at varying electrodeposition speeds at constant current or constant speed with varying current intensity were analysed. It has been determined that the use of the new electroplating bath is not only beneficial from an ecological point of view, but also in terms of the coating quality and efficiency of the process.
Downloads
References
Chowdhury M.S., Rahman K.S., Chowdhury T., Nuthammachot N., Techato K., Akhtaruzzaman Md., Tiong S.K., Sopian K. & Amin N. (2020). An overview of solar photovoltaic panels’ end-of-life material recycling. Energy Strategy Reviews, 27, 100431. Doi: https://doi.org/10.1016/j.esr.2019.100431.
Mahmoudi S., Huda N., Alavi Z., Islam M.T. & Behnia M. (2019). End-of-life photovoltaic modules: A systematic quantitative literature review. Resources, Conservation and Recycling, 146, 1–16. Doi: https://doi.org/10.1016/j.resconrec.2019.03.018.
Yu J., Li J., Zhao Y., Lambertz A., Chen T., Duan W., Liu W., Yang X., Huang Y. & Ding K. (2021). Copper metallization of electrodes for silicon heterojunction solar cells: Process, reliability and challenges. Solar Energy Materials and Solar Cells, 224, 110993. Doi: https://doi.org/10.1016/j.solmat.2021.110993.
Smyrak B., Zasadzińska M., Knych T., Mamala A., Kawecki A., Walkowicz M. & Strzępek P. (2022). Susceptibility to deep processing in the wire drawing process of ETP and OF grade copper. Metalurgija, 61(3–4), 749–752. Doi: https://hrcak.srce.hr/file/397083 (accessed: 05.05.2023).
Strzępek P. & Zasadzińska M. (2022). Pure alloy additive or preliminary alloy: A comparative study on obtaining high-strength copper magnesium alloys designed for electrical power systems. Energies, 15(6), 2093. Doi: https://doi.org/10.3390/en15062093.
Wu J., Zhou X., Chaofang D., Xiao K. & Li X. (2010). Research progress on atmospheric corrosion of copper and its alloys. Corrosion Science and Protection Technology, 22(5), 464–468.
Huang H.L., Bu F.R., Tian J. & Liu D. (2017). Influence of direct current electric field on corrosion behavior of tin under a thin electrolyte layer. Journal of Electronic Materials, 46(12), 6936–6946.
Liu Y., Wang J., Yin L., Kondos P., Parks C., Borgesen P., Henderson D.W., Cotts E.J. & Dimitrov N. (2008). Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder Interface. Journal of Applied Electrochemistry, 38, 1695–1705.
Liu Y., Wang J., Yin L., Kondos P., Parks C., Borgesen P., Hender- son D.W., Bliznakov S., Cotts E.J. & Dimitrov N. (2010). Improving copper electrodeposition in the microelectronics industry. IEEE Transaction on Components, Packaging and Manufacturing Technology, 33, 127–137. Doi: https://doi.org/10.1109/ECTC.2008.4550276.
Rosenstein C. (1990). Methane sulfonic acid as an electrolyte for tin, lead and tin-lead plating for electronics. Metal Finishing, 88, 17–21. Doi: https://p2infohouse.org/ref/25/24298.pdf (accessed: 05.05.2023).
Oulmas C., Mameri S., Boughrara D., Kadri A., Delhalle J., Mekhalif Z. & Benfedda B. (2019). Comparative study of Cu–Zn coatings electrodeposited from sulphate and chloride baths. Heliyon, 5(7), e02058. Doi: https://doi.org/10.1016/j.heliyon.2019.e02058.
Gupta A. & Srivastava C. (2022). Electrodeposition current density induced texture and grain boundary engineering in Sn coatings for enhanced corrosion resistance. Corrosion Science, 194, 109945. Doi: https://doi.org/10.1016/j.corsci.2021.109945.
Patianova A.O., Ivanova K.Yu., Kuzmin M.V., Semenov V.L. & Alexandrov R.I. (2021). Optimization of copper wire tinning for the production of solar modules. Russian Electrical Engineering, 92(8), 409–411. Doi: https://doi.org/10.3103/S1068371221080101.
Abdel-Aziz A.B., El-Zomrawy A.A., El-Sabbah M.M.B. & Ghayad I.M. (2022). Electrodeposition of lead and lead-tin alloy on copper using an eco-friendly methanesulfonate plating bath. Journal of Materials Research and Technology, 18, 2166–2174. Doi: https://doi.org/10.1016/j.jmrt.2022.03.004.
Juškėnas R., Mockus Z., Kanapeckaitė S., Stalnionis G. & Survila A. (2006). XRD studies of the phase composition of the electro-deposited copper-rich Cu–Sn alloys. Electrochimica Acta, 52(3), 928–935. Doi: https://doi.org/10.1016/j.electacta.2006.06.029.
Huang X., Chen Y., Zhou J., Zhang Z. & Zhang J. (2013). Electrochemical nucleation and growth of Sn onto double reduction steel substrate from a stannous fluoborate acid bath. Journal of Electroanalytical Chemistry, 709, 83–92. Doi: https://doi.org/10.1016/j.jelechem.2013.09.012.
Kim J.-H., Suh M.-K. & Kwon H.-S. (1996). Effects of plating conditions on the microstructure of 80Sn 20Pb electrodeposits from an organic sulphonate bath. Surface and Coatings Technology, 78(1–3),56–63. Doi: https://doi.org/10.1016/0257-8972(94)02392-1.
Low C.T.J. & Walsh F.C. (2008). Electrodeposition of tin, copper and tin–copper alloys from a methanesulfonic acid electrolyte containing a perfluorinated cationic surfactant. Surface and Coatings Technology, 202(8), 1339–1349. Doi: https://doi.org/10.1016/j.surfcoat.2007.06.032.
Walsh F.C. & Low C.T.J. (2016). A review of developments in the electrodeposition of tin. Surface and Coatings Technology, 288, 79–94. Doi: https://doi.org/10.1016/j.surfcoat.2015.12.081.
Bengoa L.N., Pary P., Conconi M.S. & Egli W.A. (2017). Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol. Electrochimica Acta, 256, 211–219. Doi: https://doi.org/10.1016/j.electacta.2017.10.027.
Walsh F.C. & Low C.T.J. (2016). Composite, multilayer and three-dimensional substrate supported tin-based electrodeposits from methanesulphonic acid. The International Journal of Surface Engineering and Coatings, 94(3), 152–158. Doi: https://doi.org/10.1080/00202967.2016.1162399.
Pewnim N. & Roy S. (2013). Electrodeposition of tin-rich Cu-Sn alloys from a methanesulfonic acid electrolyte. Electrochimica Acta, 90, 498–506. Doi: https://doi.org/10.1016/j.electacta.2012.12.053.
Sharma A., Das K., Fecht H.-J. & Das S. (2014). Effect of various additives on morphological and structural characteristics of pulse electrodeposited tin coatings from stannous sulfate electrolyte. Applied Surface Science, 314(30), 516–522. Doi: https://doi.org/10.1016/j.apsusc.2014.07.037.
Krajaisri P., Puranasiri R., Chiyasak P. & Rodchanarowan A. (2022). Investigation of pulse current densities and temperatures on electrodeposition of tin-copper alloys. Surface & Coatings Technology, 435, 128244. Doi: https://doi.org/10.1016/j.surfcoat.2022.128244.
Sharma A., Jang Y.J. & Jung. J.P. (2015). Effect of current density on morphology of electroplated tin. Surface Engineering, 31(6), 458–464. Doi: https://doi.org/10.1179/1743294414Y.0000000427.
Illarionova M.S., Ivanova K.Yu., Kuzmin M.V., Patianova A.O. & Semenov V.L. (2022). Development of technology for obtaining electrodes based on copper wire used in the manufacture of solar modules. Chimica Techno Acta, 9(2S), 202292S1. Doi: https://doi.org/10.15826/chimtech.2022.9.2.S1.
Zanella C., Xing S. & Deflorian F. (2013). Effect of electrodeposition parameters on chemical and morphological characteristics of Cu–Sn coatings from a methanesulfonic acid electrolyte. Surface and Coatings Technology, 236, 394–399. Doi: https://doi.org/10.1016/j.surfcoat.2013.10.020.
Sharma A., Bhattacharya S., Das S. & Das K. (2014). A study on the effect of pulse electrodeposition parameters on the morphology of pure tin coatings. Metallurgical and Materials Transactions A, 45, 4610–4622. Doi: https://doi.org/10.1007/s11661-014-2389-8.
Downloads
Published
Issue
Section
License
Copyright (c) 2023 Aleksander Olędzki, Tadeusz Knych, Małgorzata Zasadzińska
This work is licensed under a Creative Commons Attribution 4.0 International License.